To fill the finest gap between processor and heatsink.
High thermal conductivity to transfer heat efficiently.
CLEAN: ALSO IMPORTANT
Cleanser is included to help provide a clean surface before application.
SPREAD EVENLY WITH SPREADER
To achieve a thin layer of application, a transparent plastic spreader is inlcuded.
< 0.05 ℃-cm3/W
-40 ~ 180℃