ID-COOLING Frost X25 4G Thermal Paste
NANO MATERIAL
To fill the finest gap between processor and heatsink.
10.5W/M-K
High thermal conductivity to transfer heat efficiently.
CLEAN: ALSO IMPORTANT
Cleanser is included to help provide a clean surface before application.
SPREAD EVENLY WITH SPREADER
To achieve a thin layer of application, a transparent plastic spreader is inlcuded.
Specifications:
Thermal Conductivity | 10.5 W/m-K |
Thermal Impedence | < 0.05 ℃-cm3/W |
Dielectric Constant | 5 |
Density | 2.6g/cm3 |
Viscosity | 560 Pas |
Operation Temperature | -40 ~ 180℃ |