ASUS TUF Gaming GeForce RTX 3060Ti 8GB GDDR6X
TAKE FLIGHT
From top to bottom, the ROG Strix GeForce RTX™ 3060 Ti has been radically improved to accommodate the impressive new NVIDIA Ampere architecture and to deliver the next wave of gaming performance innovation to the market. A fresh design and more metal surrounds a grouping of Axial-tech fans. Last gen’s uniform fan layout has been usurped by a new rotation scheme and specialized roles for central and auxiliary fans. Below the blades, a larger, more impressive heatsink is ready for the most demanding thermal loads. The PCB has some new tricks up its sleeves, and even the backplate has received some performance-boosting changes. You’ve been waiting for the latest and greatest in graphics card design – and this is it.
AXIAL-TECH UPGRADES
Our Axial-tech fan design has been optimized for a new, larger heatsink that features more fins and surface area than last gen. The blade count has been increased on all three fans, with 13 on the center fan and 11 on the auxiliary fans. The barrier ring on the side fans has been slimmed down to allow for more lateral intake and to provide better airflow through the cooling array. The center fan’s extra blades and full-height ring provide boosted static pressure to blast air directly onto the GPU heat spreader.
NEW DIRECTIONS
To bolster the specialized roles of the center and auxiliary fans, the rotational direction of the center fan is reversed. This reduces air turbulence inside the cooling array for another boost to overall thermal performance. The fans also shut off completely when card power consumption is low and the GPU temperature falls beneath 48 Celsius, keeping noise levels down when the system is under a light load.
MAXCONTACT
To get heat up off the die and into the heatsink array to benefit from the new fan design requires special attention. We use a manufacturing process that polishes the surface of the heat spreader to improve smoothness at the microscopic level. The extra flatness allows for better contact with the die for improved thermal transfer.