MSI X670E GAMING PLUS WIFI DDR5 AM5 – NEW
COOLING OVERVIEW
Extended Heatsink enlarges the surface of heat dissipation and maintain the performance at heavy loads. The VRM heatsink covers the upper MOS and helps dissipate the heat. Strengthened M.2 thermal solution helps M.2 SSD safe and ensures incredible performance. High-quality 7W/mK MOSFET thermal pads and additional choke thermal pads ensure stable performance when all cores are running at high speed
OPTIMIZED FOR WATER COOLING
FAST AND FUTURE-READY STORAGE
MSI X670E GAMING PLUS WIFI motherboards supports all the latest storage standards, which allows users to connect any ultra-fast storage device. Start games faster, load levels faster and have a real advantage over your enemies.
THE ISOLATED ANALOGY STRUCTURE FOR AUDIO CONNECTORS
To provide clear voice, MSI develops a unique structure – Isolated Analogy Structure. The external metal framework of the audio connectors is separated from the internal layout, which ensures the sound quality crisp.