ID-COOLING Frost X25 4G Thermal Paste
₨2,500
- Thermal Conductivity: 10.5 W/m-K
- Thermal Impedence: < 0.05 ℃-cm3/W
- Dielectric Constant: 5
- Density: 2.6g/cm3
- Viscosity: 560 Pas
- Operation Temperature: -40 ~ 180℃
Out of stock
ID-COOLING Frost X25 4G Thermal Paste
NANO MATERIAL
To fill the finest gap between processor and heatsink.
10.5W/M-K
High thermal conductivity to transfer heat efficiently.
CLEAN: ALSO IMPORTANT
Cleanser is included to help provide a clean surface before application.
SPREAD EVENLY WITH SPREADER
To achieve a thin layer of application, a transparent plastic spreader is inlcuded.
Specifications:
|
Thermal Conductivity |
10.5 W/m-K |
|
Thermal Impedence |
< 0.05 ℃-cm3/W |
|
Dielectric Constant |
5 |
|
Density |
2.6g/cm3 |
|
Viscosity |
560 Pas |
|
Operation Temperature |
-40 ~ 180℃ |
| Brands | ID-COOLING |
|---|
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